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HTC Grinding Plate

Arrow Segment Concrete Floor Grinding Plate for HTC

with Double Arrrow Grinding Segment H8mm

Description
Arrow diamond designed for aggressive coating removal and concrete grinding;
Arrow diamond segment size: H8mm, H10mm, H12mm  etec;
Grit: 6#,16#,30#,60#,80#,120#,150#,220# etc
Bond: Super Soft, Soft, Medium Hard, Hard, Super Hard;
Wet or Dry Use.

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